Innovation shifts beyond the chip
36:20–36:31 · 11s
Gliklich says with Moore’s Law breaking down, innovation is moving into packaging and circuit boards, which are growing faster than front-end semis.
36:20–36:31 · 11s
Gliklich says with Moore’s Law breaking down, innovation is moving into packaging and circuit boards, which are growing faster than front-end semis.
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